发明名称 |
ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION |
摘要 |
Methods for depositing a low dielectric constant layer on a substrate are provided. In one embodiment, the method includes introducing one or more organosilicon compounds into a chamber, wherein the one or more organosilicon compounds comprise a silicon atom and a porogen component bonded to the silicon atom, reacting the one or more organosilicon compounds in the presence of RF power to deposit a low dielectric constant layer on a substrate in the chamber, and post-treating the low dielectric constant layer to substantially remove the porogen component from the low dielectric constant layer. Optionally, an inert carrier gas, an oxidizing gas, or both may be introduced into the processing chamber with the one or more organosilicon compounds. The post-treatment process may be an ultraviolet radiation cure of the deposited material. The UV cure process may be used concurrently or serially with a thermal or e-beam curing process. The low dielectric constant layers have good mechanical properties and a desirable dielectric constant. |
申请公布号 |
WO2011106218(A2) |
申请公布日期 |
2011.09.01 |
申请号 |
WO2011US25093 |
申请日期 |
2011.02.16 |
申请人 |
APPLIED MATERIALS, INC.;YIM, KANG SUB;DEMOS, ALEXANDROS, T. |
发明人 |
YIM, KANG SUB;DEMOS, ALEXANDROS, T. |
分类号 |
C23C16/18;C23C16/30;C23C16/50;H01L21/205 |
主分类号 |
C23C16/18 |
代理机构 |
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