| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure reducing the possibility of breakdown of a bonded part between a semiconductor circuit board side and a mounting substrate side to protect it. SOLUTION: A flip-flop mounting device is a flip-flop mounting device formed by flip-flop bonding the semiconductor circuit board 11 onto the mounting substrate 21 and includes a resin wall 41 whose side surface is included in a plane including a side surface of the semiconductor circuit board 11, wherein the mounting substrate 21, the semiconductor circuit board 11 and the resin wall 41 define a gap to avoid inflow of moisture and dust from the outside. COPYRIGHT: (C)2011,JPO&INPIT |
