| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup element widely ensuring a normal film forming area free from quality failures such as frame color unevenness and peeling in a later color filter forming process regardless of a structure with a pixel part forming area surface formed lower than an upper surface of a multilayer wiring part in the solid-state image pickup element having a pixel part with a plurality of photoelectric conversion elements arranged on a plane, and the multilayer wiring part laminated and arranged around the pixel part. SOLUTION: In the solid-state image pickup element, a step is formed in the vicinity of a boundary between both parts that a front surface of a light receiving plane of the pixel part area is positioned lower than the upper surface of the multilayer wiring part area, and a sloped transparent resin layer whose surface protrudes downward is provided on a surface ranging from the step to the pixel part. COPYRIGHT: (C)2011,JPO&INPIT
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