发明名称 |
JOINING DEVICE |
摘要 |
<p>In the disclosed joining device, a conveying area and a processing area are formed. A conveyance mechanism that conveys a first substrate, a second substrate, or a polymerized substrate, a position adjustment mechanism that adjusts the horizontal orientation of the first substrate or the second substrate, and an inverting mechanism that inverts the front and back surfaces of the second substrate are provided to the conveyance area. A first holding member that loads and holds the first substrate on the upper surface thereof, a second holding member that holds the second substrate on the bottom surface thereof, and a pushing member that brings one end of the first substrate and one end of the second substrate into contact and applies pressure at the time of joining of the first substrate and the second substrate are provided to the processing area.</p> |
申请公布号 |
WO2011105326(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
WO2011JP53674 |
申请日期 |
2011.02.21 |
申请人 |
TOKYO ELECTRON LIMITED;NISHIBAYASHI, TAKAHIRO;KITAYAMA, TATSUYA;YOSHITAKA, NAOTO |
发明人 |
NISHIBAYASHI, TAKAHIRO;KITAYAMA, TATSUYA;YOSHITAKA, NAOTO |
分类号 |
H01L21/02;H01L21/677;H01L27/12 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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