发明名称 JOINING METHOD, PROGRAM, AND COMPUTER RECORDING MEDIUM
摘要 <p>In the disclosed joining method, a first substrate and a second substrate are surface activated, surface hydrophilized, and cleaned, and then are conveyed to a joining device. In the joining device, the horizontal orientation of the first substrate and the second substrate are adjusted, and the first substrate and the second substrate are respectively held by a first holding member and a second holding member. At this time, the front and back surfaces of the second substrate are inverted. Next, after adjusting the horizontal position of the first substrate and the second substrate, the first substrate and the second substrate are disposed facing each other across a predetermined gap. Next, one end of the first substrate and one end of the second substrate are put into contact and pressed together. Next, in the state where one end of the first substrate and one end of the second substrate are pressed together, the second substrate is successively brought into contact with the first substrate from the side of said one end of said second substrate towards the other end, joining the first substrate and the second substrate.</p>
申请公布号 WO2011105325(A1) 申请公布日期 2011.09.01
申请号 WO2011JP53670 申请日期 2011.02.21
申请人 TOKYO ELECTRON LIMITED;NISHIBAYASHI, TAKAHIRO;HIROSE, KEIZO;YOSHITAKA, NAOTO;KITAYAMA, TATSUYA 发明人 NISHIBAYASHI, TAKAHIRO;HIROSE, KEIZO;YOSHITAKA, NAOTO;KITAYAMA, TATSUYA
分类号 H01L21/02;H01L21/677;H01L27/12 主分类号 H01L21/02
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