SEMICONDUCTOR DEVICE HAVING FUSE AND CUTTING METHOD THEREOF

摘要

A semiconductor device and methods of cutting a fuse of a semiconductor device are provided, the semiconductor device includes a semiconductor substrate that includes a fuse region, a plurality of fuse patterns disposed in the fuse region of the semiconductor substrate, and an insulating layer that insulates the fuse patterns from the semiconductor substrate. The fuse patterns each include a fuse. The fuse patterns are linked to the semiconductor substrate.