发明名称 HEAT-DISSIPATION SYSTEM
摘要 PROBLEM TO BE SOLVED: To solve such a problem that it is required to press a metal plate without a gap against on a heat-dissipating sheet stacked on an electronic component, therefore, if external force such as drop impact is applied to the metal plate, the impact is directly transmitted to the heat-dissipating sheet and the electronic component, and consequently, the electronic component is broken. SOLUTION: A heat-dissipation system comprises: a leaf spring 101 that is composed of a heat-receiving part 104 installed on an electronic component 113 while sandwiching a heat-dissipating sheet 109 therebetween so as to receive heat from the electronic component 113, and each long spring 102 and each short spring 103 respectively integrally molded with the heat-receiving part 104 while forming an acute angle from the heat-receiving part 104; the heat-dissipating sheet 109 for covering the leaf spring 101 from the outer surface; and a metal plate 115 for pressing the long springs 102 and short springs 103, covered with the heat-dissipating sheet 109, from above. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011171332(A) 申请公布日期 2011.09.01
申请号 JP20100030952 申请日期 2010.02.16
申请人 PANASONIC CORP 发明人 YASUOKA HARUKI
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
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