| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent movement and scattering of solder, which occur due to melting of the solder in an electronic component built-in module, by heating when the electronic component built-in module is mounted. <P>SOLUTION: The electronic component built-in module 1 includes the electronic component 2, a substrate 3 on which the electronic component 2 is mounted, a first resin 10 covering the electronic component 2 and the substrate 3 and a second resin 4 covering a surface of the first resin 10. The first resin 10 is constituted of resin having a gap. The first resin 10 is constituted in such a way that an area on which the electronic component 2 is not mounted becomes thicker than an area on which the electronic component 2 is mounted on a surface of the substrate 3. Porosity of the second resin 4 is lower than that of the first resin 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
