发明名称 |
3D Semiconductor Package Using An Interposer |
摘要 |
A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die.
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申请公布号 |
US2011210444(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US20100813212 |
申请日期 |
2010.06.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
JENG SHIN-PUU;CHEN KIM HONG;HOU SHANG-YUN;SHIH CHAO-WEN;HSIEH CHENG-CHIEH;YU CHEN-HUA |
分类号 |
H01L23/538;H01L21/60;H01L23/488 |
主分类号 |
H01L23/538 |
代理机构 |
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主权项 |
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