| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device that is easily reduced height, and a method of manufacturing the same. <P>SOLUTION: An electronic device includes an insulating substrate 1 that has a recess 2 for accommodating an electronic component 4 at the upper face and a wiring conductor 3 disposed from the bottom face of the recess 2 to the outer surface and the electronic component 4 that has an electrode 6 on one principal plane of the plate-like body 5 and is accommodated in the recess 2 with one principal plane facing downward and the electrode 6 electrically connected with the wiring conductor 3. Part of an inner side face of the recessed portion 2 in the height direction hangs over so as to surround the side face of the electronic component 4. The tip of the hanged-over portion 1a is joined all over the circumference of the side face of the electronic component 4 to hermetically seal the electrode 6. Since the electrode 6 is hermetically sealed by the joint of the hanged-over portion 1a to the electronic component 4, the recess 2 can be made shallow, no cover is required, and a low height can easily be achieved. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
