| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component housing package that is provided with a through-hole to be easily filled with a sealing member on a lower insulating layer, and to be easily thinned. <P>SOLUTION: The electronic component housing package has: a lower insulating layer 101a having a mounted portion 103 on an upper surface thereof; an upper insulating layer 101b laminated on the lower insulating layer 101a to encircle the mounted portion 103; a groove 108 formed from the lower end to the upper end on an internal surface of the upper insulating layer 101b; a conductor 109 deposited from the lower end to the upper end of the internal surface of the groove 108 to embed the groove 108 at least at the lower end of the groove 108; the through-hole 110 formed on the lower insulating layer 101a and having an upper opening which is partially filled by the lower end surface of the conductor 109 inside the groove 108; and an annular metal layer 111 deposited on the internal surface of the through-hole 110 to encircle the entire internal surface thereof. A sealing member 114 is retained at the lower end surface of the conductor 109 within the through-hole 110, thus the through-hole 110 being hermetically sealed by the sealing member 114. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
