发明名称 |
Biocompatible Bonding Method and Electronics Package Suitable for Implantation |
摘要 |
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
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申请公布号 |
US2011213443(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US20100861729 |
申请日期 |
2010.08.23 |
申请人 |
GREENBERG ROBERT J;MANN ALFRED E;TALBOT NEIL;OK JERRY;NOLAN GAILLARD R;ZHOU DAU MIN |
发明人 |
GREENBERG ROBERT J.;MANN ALFRED E.;TALBOT NEIL;OK JERRY;NOLAN GAILLARD R.;ZHOU DAU MIN |
分类号 |
A61F9/08;A61N1/05;A61N1/375;H05K1/03;H05K3/00;H05K3/32;H05K3/36;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
A61F9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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