发明名称 LIQUID REPELLENT FILM FORMER, METHOD FOR FORMING LIQUID REPELLENT FILM, METHOD FOR FORMING FINE WIRING USING THE SAME AND SUBSTRATE COMPRISING THE SAME
摘要 Disclosed are a liquid-repellent film former, a method for forming a liquid-repellent film, a method for forming fine wiring based on the same, and a printed circuit board including the same. The liquid-repellent film former includes a first coupling agent including a compound represented by the following Chemical Formula 1, a second coupling agent including a compound represented by the following Chemical Formula 2, and an alcohol solvent. Herein, the definitions of R1 to R8 are as described in the specification.
申请公布号 KR20110098476(A) 申请公布日期 2011.09.01
申请号 KR20100018119 申请日期 2010.02.26
申请人 SAMSUNG SDI CO., LTD. 发明人 LEE, JONG HEE;JOO, KYU NAM;KIM, YOUNG SU;KIM, JAE MYUNG
分类号 C09D183/02;B05D5/00;C09D5/00;H05K3/14 主分类号 C09D183/02
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