发明名称 |
LIQUID REPELLENT FILM FORMER, METHOD FOR FORMING LIQUID REPELLENT FILM, METHOD FOR FORMING FINE WIRING USING THE SAME AND SUBSTRATE COMPRISING THE SAME |
摘要 |
Disclosed are a liquid-repellent film former, a method for forming a liquid-repellent film, a method for forming fine wiring based on the same, and a printed circuit board including the same. The liquid-repellent film former includes a first coupling agent including a compound represented by the following Chemical Formula 1, a second coupling agent including a compound represented by the following Chemical Formula 2, and an alcohol solvent. Herein, the definitions of R1 to R8 are as described in the specification. |
申请公布号 |
KR20110098476(A) |
申请公布日期 |
2011.09.01 |
申请号 |
KR20100018119 |
申请日期 |
2010.02.26 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
LEE, JONG HEE;JOO, KYU NAM;KIM, YOUNG SU;KIM, JAE MYUNG |
分类号 |
C09D183/02;B05D5/00;C09D5/00;H05K3/14 |
主分类号 |
C09D183/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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