发明名称 HEAT INSULATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a thick heat insulating panel using a heat insulating material with a thickness of 1.0 mm or less as a compound made of 20-90 mass% rubber and 10-80 mass% resin foam. SOLUTION: In this heat insulating panel, the plate-like heat insulating material (3) provided between a pair of plate materials (1 and 2) is made of a compound comprising the 20-90 mass% rubber and the 10-80 mass% resin foam; and the thickness of the plate-like heat insulating material (3) is 1.0 mm or less. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011168966(A) 申请公布日期 2011.09.01
申请号 JP20100031120 申请日期 2010.02.16
申请人 SASAHARA YASUMASA 发明人 SASAHARA YASUMASA
分类号 E04B1/80 主分类号 E04B1/80
代理机构 代理人
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