发明名称 Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and lighting system
摘要 A light emitting diode according to the embodiment includes a conductive support member (160); a light emitting structure (145) on the conductive support member including a first conductive semiconductor layer (130), a second conductive semiconductor layer (150), and an active layer (140) between the first and second semiconductor layers; and a protective device (115) on the light emitting structure.
申请公布号 EP2362419(A2) 申请公布日期 2011.08.31
申请号 EP20110154424 申请日期 2011.02.14
申请人 LG INNOTEK CO., LTD. 发明人 JEONG, HWAN HEE;LEE, SANG YOUL;SONG, JUNE O;CHOI, KWANG KI
分类号 H01L27/15;H01L33/00;H01L33/20;H01L33/38;H01L33/62 主分类号 H01L27/15
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