发明名称 |
Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and lighting system |
摘要 |
A light emitting diode according to the embodiment includes a conductive support member (160); a light emitting structure (145) on the conductive support member including a first conductive semiconductor layer (130), a second conductive semiconductor layer (150), and an active layer (140) between the first and second semiconductor layers; and a protective device (115) on the light emitting structure. |
申请公布号 |
EP2362419(A2) |
申请公布日期 |
2011.08.31 |
申请号 |
EP20110154424 |
申请日期 |
2011.02.14 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JEONG, HWAN HEE;LEE, SANG YOUL;SONG, JUNE O;CHOI, KWANG KI |
分类号 |
H01L27/15;H01L33/00;H01L33/20;H01L33/38;H01L33/62 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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