| 摘要 |
<p>A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.</p> |
