发明名称 Method for manufacturing a semiconductor device
摘要 The method comprises forming a trench in the termination region, the trench extending from the first main surface toward the heavily doped region of the substrate. The trench in the termination region is filled with an oxide material. Columns of the first conductivity type and the second conductivity type are formed in the active region.
申请公布号 EP2362414(A1) 申请公布日期 2011.08.31
申请号 EP20110004140 申请日期 2005.12.27
申请人 THIRD DIMENSION (3D) SEMICONDUCTOR, INC. 发明人 HSHIEH, FWU-IUAN;PRATT, BRIAN, D.
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
代理机构 代理人
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