发明名称 |
SLIDE BEARING |
摘要 |
<p>The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 µm is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass% to 20 mass% (the minimum amount of Sn is 4 mass%) and has a hardness of Hv 150 or less.</p> |
申请公布号 |
EP2133580(A4) |
申请公布日期 |
2011.08.31 |
申请号 |
EP20080721940 |
申请日期 |
2008.03.12 |
申请人 |
TAIHO KOGYO CO., LTD |
发明人 |
SUGA, SHIGEYUKI;WADA, HITOSHI;TOMIKAWA, TAKASHI |
分类号 |
F16C33/12;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/06;C22C13/00 |
主分类号 |
F16C33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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