发明名称
摘要 PROBLEM TO BE SOLVED: To provide a soldering-direction-design supporting apparatus which supports a suitable soldering-direction-design that can obtain a good soldering result in soldering where a substrate with a component mounted is charged into a soldering bath with a solder melted and component soldering is carried out; and to provide a soldering-direction-design supporting method. SOLUTION: The soldering-direction-design supporting apparatus includes a means which obtains a substrate design data that is design data of components location on a substrate, a means which obtains reference data of charge direction evaluation that decides the optimum charge direction of each component kind of the components charged into a soldering bath, a means which obtains charge direction data that decides the charge direction into the soldering bath where the substrate as an evaluation object is to be evaluated, and a means which evaluates whether the charge direction into the soldering bath decided by the charge direction data coincides with the optimum charge direction into the soldering bath of the reference data of the charge direction evaluation for all the components contained in the substrate design data and decides the soldering direction of the substrate on the basis of the evaluation result. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP4763491(B2) 申请公布日期 2011.08.31
申请号 JP20060083713 申请日期 2006.03.24
申请人 发明人
分类号 H05K3/34;B23K1/08 主分类号 H05K3/34
代理机构 代理人
主权项
地址