| 摘要 |
A guiding apparatus for guiding a heat sink easily to be attached to a circuit board to cool an electronic element mounted on the circuit board and includes a seat, and a pair of guiding members. The heat sink includes a pair of fasteners movably attached thereto. A number of flexible barbs are formed at an end of each fastener. The seat is elongated and includes a sliding groove defined therein along a length thereof. Each guiding member includes a post, a first block, a second block, and a resilient member. The first and second blocks surround the post. The first block is received in the sliding groove. The resilient member slidably surrounds the post and sandwiched between the second block and the seat. A locating hole is defined in the post adjacent to the second block to receive the barbs of the fastener.
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