发明名称 |
Micro-fluidic interconnector |
摘要 |
A method of bonding a capillary tube made of a thermally deformable material to a passage in a glass wafer comprising the steps of treating the surface of the capillary tube to render the surface bondable and wettable by a conventional epoxy resin; inserting a support inside the capillary to prevent inward deformation of the capillary during subsequent fabricating steps; inserting the supported capillary inside the port on the wafer; heating an end of the capillary proximate a bottom portion of the port to effect melting of a portion of the heated end of the capillaries; moving the melted end of the capillary into contact with a wall of the port at a desired location for the capillary in the port, thus forming a temporary seal between the capillary and the wall of the port; and introducing an epoxy around the capillary to bind the capillary to the wafer.
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申请公布号 |
US8007626(B2) |
申请公布日期 |
2011.08.30 |
申请号 |
US20090428147 |
申请日期 |
2009.04.22 |
申请人 |
LEHIGH UNIVERSITY |
发明人 |
PATTEKAR ASHISH V.;KOTHARE MAYURESH V. |
分类号 |
B32B37/28;B01J19/00;C01B3/32 |
主分类号 |
B32B37/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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