Burn-in system for electronic devices

摘要

A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating element (16) is configured to generate heat within the burn-in chamber (14) and a temperature sensor (18) is configured to sense a temperature within the burn-in chamber (14). An opening (24) is formed in the enclosure (12) for receiving a fluid (26). A controller (20) is configured to control the heating element (16) and fluid flow into the enclosure (12) in response to the temperature sensed by the temperature sensor (18).