发明名称 Polyamide resin composition
摘要 Provided is a polyamide resin composition superior in mechanical properties such as strength and elastic modulus and also in toughness, durability, frictional abrasion resistance, and water absorption resistance, wherein the polyamide resin composition contains 0.1 to 4 parts by mass of an aliphatic epoxy compound (B) having three glycidyl groups in the molecule, formulated to 100 parts by mass of a polyamide resin (A) with silicate layers of swellable lamellar silicate dispersed therein. The epoxy equivalence of the aliphatic epoxy compound (B) is preferably 180 g/eq or less, and the aliphatic epoxy compound (B) preferably has trimethylolpropane and/or glycerol as a skeleton.
申请公布号 US8008389(B2) 申请公布日期 2011.08.30
申请号 US20070296642 申请日期 2007.04.24
申请人 UNITIKA LTD. 发明人 NEGI YUKINARI
分类号 C08K3/34;C08L77/00 主分类号 C08K3/34
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