发明名称 |
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate |
摘要 |
A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first carrier is removed. The first die and substrate with the first encapsulant is mounted to a second carrier. A second semiconductor die is mounted to a second surface of the substrate opposite the first surface of the substrate. A second encapsulant is deposited over the second die. The second carrier is removed. A bump is formed over the second surface of the substrate. A conductive layer can be mounted over the first die. A second conductive via can be formed through the first encapsulant and electrically connected to the first conductive via. The semiconductor packages are stackable. |
申请公布号 |
US8008121(B2) |
申请公布日期 |
2011.08.30 |
申请号 |
US20090612365 |
申请日期 |
2009.11.04 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
CHOI DAESIK;KIM JONGHO;LEE HYUNGMIN |
分类号 |
H01L21/00;H01L23/02 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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