发明名称 |
Integrated circuit and method of forming an integrated circuit |
摘要 |
An integrated circuit and a method of forming an integrated circuit. One embodiment includes a conductive line formed above a surface of a carrier. A slope of the sidewalls of the conductive line in a direction perpendicular to the surface of the carrier reveals a discontinuity and a width of the conductive line in an upper portion thereof is larger than the corresponding width in the lower portion.
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申请公布号 |
US8009477(B2) |
申请公布日期 |
2011.08.30 |
申请号 |
US20080182714 |
申请日期 |
2008.07.30 |
申请人 |
QIMONDA AG |
发明人 |
KLEINT CHRISTOPH;NAGEL NICOLAS;OLLIGS DOMINIK;MARKERT MATTHIAS |
分类号 |
G11C11/40;H01L21/4763;H01L27/088;H01L29/78 |
主分类号 |
G11C11/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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