发明名称 III nitride single crystal and method of manufacturing semiconductor device incorporating the III nitride single crystal
摘要 A III nitride single-crystal manufacturing method in which a liquid layer (3) of 200 μm or less thickness is formed in between a substrate (1) and a III nitride source-material baseplate (2), and III nitride single crystal (4) is grown onto the face (1s) on the liquid-layer side of the substrate (1). Herein, the substrate (1) in at least a superficial layer (1a) on the liquid-layer side may be formed of a III nitride single crystal, while the III nitride source-material baseplate (2) can be formed of a III nitride polycrystal. Further, the substrate (1) in at least a superficial layer (1a) on the liquid-layer side, and the III nitride source-material baseplate (2) can be formed of a III nitride single crystal, while the face (1s) on the liquid-layer side of the substrate (1) can be made a III-atom surface, and the face (2s) on the liquid-layer side of the III nitride source-material baseplate (2) can be made a nitrogen-atom surface.
申请公布号 US8008173(B2) 申请公布日期 2011.08.30
申请号 US20090419310 申请日期 2009.04.07
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NAKAHATA SEIJI
分类号 H01L21/00 主分类号 H01L21/00
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