| 摘要 |
The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt.%) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270°C, wherein the wt.% is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20°C - Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by biaxial stretching. The film has properties suitable for carrier films in flexible printed circuit boards. |
