METHODS FOR EXAMINING A BONDING STRUCTURE OF A SUBSTRATE AND BONDING STRUCTURE INSPECTION DEVICES
摘要
In an embodiment, a method for examining a bonding structure of a substrate may be provided. The method may include: providing a substrate including a bonding structure to be examined; determining one or more stereoscopic images including one or a plurality of predefined regions of interests of portions of the bonding structure to be examined, the predefined regions of interests corresponding to reference regions of interests in a stored predetermined reference model of a reference bonding structure of a reference substrate; determining one or more two-dimensional feature parameters and one or more three-dimensional feature parameters of the bonding structure to be examined from one or more of a plurality of the predefined regions of interests; and determining as to whether the determined feature parameters fulfill at least one predefined quality criterion with respect to the reference model.
申请公布号
SG173068(A1)
申请公布日期
2011.08.29
申请号
SG20110052479
申请日期
2010.02.08
申请人
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH;COMPONENT TECHNOLOGY PTE LTD
发明人
CHUNG, KUM PANG;LAM, CHEW JUNN;XU, JIAN;LIU, TONG;TANG, ZAI XIN;ZAKARIA, ALBERTUS