POLISHING SLURRY FOR SILICON OXIDE, ADDITIVE LIQUID AND POLISHING METHOD

摘要

A polishing agent for the silicon oxide film on a polysilicon film, which comprises abrasive grains, an abrasion inhibitor for polysilicon, and water. It is preferable that the abrasion inhibitor is (1) a water-soluble polymer having a skeleton made from an N monosubstituted or N,N-disubstituted derivative of any of acrylamide, methacrylamide and -substituted derivatives of both, (2) polyethylene glycol, (3) an oxyethylene adduct of an acetylenic diol, (4) a water-soluble organic compound having an acetylenic linkage, (5) an alkoxylated straight-chain aliphatic alcohol, or (6) polyvinylpyrrolidone or a vinyl- pyrrolidone copolymer. The invention provides a polishing agent and a method of polishing which are applied to the production of semiconductors, namely, a polishing agent for silicon oxide which can polish a silicon oxide film on a polysilicon film at a high speed and inhibit the progress of abrasion of the polysilicon film when the polysilicon film becomes exposed; and a method of polishing with the agent.