发明名称 |
CMP METHOD FOR METAL-CONTAINING SUBSTRATES |
摘要 |
An aqueous chemical-mechanical polishing composition for polishing metal containing substrates comprising an abrasive particle consisting essentially of a primary particle modified with an aluminosilicate layer, and wherein the abrasive particle has a zeta potential measured at pH 2.3 of about -5 mV to about -100mV. The composition can be used to polish the surface of a tungsten containing substrate.Figure 1 |
申请公布号 |
SG173361(A1) |
申请公布日期 |
2011.08.29 |
申请号 |
SG20110050010 |
申请日期 |
2007.07.06 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
VACASSY, ROBERT;ZHOU, RENJIE |
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