发明名称 ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic device more reducing an inductance of wiring for grounding a semiconductor element than ever. <P>SOLUTION: The device includes the semiconductor element 10, and a grounding table 14 connected with the semiconductor element 10 via the wiring to ground the semiconductor element 10. The grounding table 14 has a height with which a difference between a value of the length of the wiring connecting the semiconductor element 10 with the grounding table 14 and a threshold value is held in a predetermined range. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011165720(A) 申请公布日期 2011.08.25
申请号 JP20100023591 申请日期 2010.02.04
申请人 OPNEXT JAPAN INC 发明人 TAKAMATSU SHOJI;SHISHIKURA MASATO;SASADA MICHIHIDE
分类号 H01L23/12 主分类号 H01L23/12
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