| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a layered structure, especially for a printed wiring board, that prevents a reduction in resolution, achieves excellent adhesion between a photosensitive resin layer and a substrate, and prevents layer separation during PCT or hot-cold cycles, while keeping the coefficient of linear thermal expansion of the entire photosensitive resin layer as low as possible, and to provide a photosensitive dry film used as a solder resist, an interlayer resin insulation layer or the like in the layered structure. <P>SOLUTION: The layered structure has, at least, a substrate (1) and a photosensitive resin layer or cured coating layer (2), containing an inorganic filler (3) formed on top of the substrate. In the photosensitive resin layer or cured coating layer, the content of the inorganic filler is low on the side in contact with the substrate and high on the surface side distant from the substrate. Preferably, the content of the inorganic filler in the photosensitive resin layer or cured coating layer increases continuously gradually or stepwise from the side in contact with the substrate to the surface side distant from the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
