发明名称 TEST HEAD, AND SEMICONDUCTOR WAFER TEST DEVICE EQUIPPED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a test head that can suppress bending of a probe card. SOLUTION: The test head 40 includes: a test head body 50 having a frame 51; an interface device 60 electrically connecting the probe card 20 and test head body 50 to each other; and a brake unit 80 interposed between the probe card 20 and frame 51, and transmitting pressure F, applied to the probe card 20, to the frame 51. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011165960(A) 申请公布日期 2011.08.25
申请号 JP20100027900 申请日期 2010.02.10
申请人 ADVANTEST CORP 发明人 DOI ATSUSHI
分类号 H01L21/66;G01R1/06;G01R31/28 主分类号 H01L21/66
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