| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid-cooled integrated substrate reduced in raw material cost and processing cost, reduced in warpage (shape deformation) as the integrated substrate, and excellent in strength and heat radiating property, and to provide a method of manufacturing the same. <P>SOLUTION: In the liquid-cooled integrated substrate 1 constructed such that a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramics substrate 10, one surface of a plate-shaped metal base plate 20 made of aluminum or an aluminum alloy is bonded to the other surface, a liquid-cooled radiator 30 constituted of an extrusion material is bonded to the other surface of the metal base plate 20, the relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1≥2, the thickness t1 of the metal circuit board 15 is 0.4-3 mm, and the thickness t2 of the metal base plate 20 is 0.8-6 mm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
