| 摘要 |
PROBLEM TO BE SOLVED: To provide a kerf checking method and a kerf checking system for a dicing device that accurately make kerf check even for transparent and translucent wafers. SOLUTION: After a predetermined number of grooves are formed on a wafer W at predetermined intervals by a blade, a street SP1-4 which is two grooves away from the street of a groove SP1-3 formed finally among the predetermined number of grooves is cut by the blade to form a groove 52C for kerf check, and the groove 52C for kerf check is used to make kerf check on the blade. COPYRIGHT: (C)2011,JPO&INPIT |
