| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent laser marking characteristics and soldering heat resistance, and a semiconductor device sealed with the epoxy resin composition to exhibit superior laser marking visibility. SOLUTION: The epoxy resin composition principally consisting of an epoxy resin (A), a curing agent (B), and an inorganic filler (C) contains carbon black (D) with a DBP adsorption quantity of 100 cm<SP>3</SP>/100 g or more. The inorganic filler (C) contains at least one of crushed silica (c1) with a mean diameter of 0.1-10 μm or micro fine spherical silica (c2) with a mean diameter of 1-100 nm. A resin-sealed semiconductor device sealed with the resin composition is also provided. COPYRIGHT: (C)2011,JPO&INPIT |
