| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mold release film which, when a CL film is adhered to a circuit exposure film, can obtain better embedding properties than those of a conventional mold release film while preventing the adhesion of a mold release layer to the circuit exposure film and the CL film. <P>SOLUTION: A laminated film (100, 100A) has a first mold release layer (110, 110a) and a cushion layer (120). The first release layer is made from a resin containing a syndiotactic polystyrene resin as a main component. The crystallinity of this resin measured by a differential scanning calorimetric method is≥14.0% and <30.0%. The cushion layer is prepared on one side of the first release layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
