| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device for reducing a chip area for forming the solid-state image pickup device and reducing the cost of an individual chip, and to provide miniaturized electronic equipment by employing the solid-state image pickup device. <P>SOLUTION: The solid-state image pickup device has a structure in which a first substrate 80 having a photoelectric conversion unit PD and a second substrate 81 having a charge storage capacity unit 61 and a plurality of MOS transistors are laminated. Connection electrodes (26, 27, 56, 57) which are formed at the first substrate 80 and the second substrate 81, respectively, and electrically connect the first substrate 80 and the second substrate 81. By this, the solid-state image pickup device having a global shutter function can be formed in a smaller area. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
