发明名称 PLANE-TYPE EVAPORATION SOURCE, EVAPORATION PLATING METHOD THEREFOR AND SYSTEM THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a plane-type evaporation source, an evaporation plating method therefor and a system therefor. SOLUTION: In the plane-type evaporation source, the evaporation method therefor and the system therefor, at least one evaporation material is applied to one side in an evaporation source substrate so as to be a plane-type evaporation source. The distribution area of the evaporation material is made into an area involving an evaporation objective base material after the vaporization of the evaporation material. Since a heating apparatus is arranged in an area capable of heating the evaporation source substrate, and the heating apparatus provides a heat source to the plane-type evaporation source, the plane-type evaporation source is converted from a solid into a gas and is diffused over the surface of the evaporation objective base material. Since, based on the means of stepwise controlling the vapor in a molecular or atomic state, a film is formed according to the mechanism of surface-nucleation, condensation and growth, a film having superior evenness, nano-scale adjustability, specialized structure and function that can not be achieved by the films from conventional spray coating and ink jet means can be obtained. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011162881(A) 申请公布日期 2011.08.25
申请号 JP20110025688 申请日期 2011.02.09
申请人 IND TECHNOL RES INST 发明人 CHIN KENSHI;WANG CHING-CHIUN;GO KEIKI;TUNG FU-CHING
分类号 C23C14/24;C23C14/04;H01L51/50;H05B33/10 主分类号 C23C14/24
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