发明名称 |
Package device e.g. cuboids package, for joining cake wafers, has package casing removal assistance, intermediate layers and coating bags, where emptying of coating bags takes place under utilization of principle of emptying of finger gap |
摘要 |
<p>The device i.e. kebab package (1), has a package casing (2) including a cardboard box with a base part and a cover part in connection with a transparency bag. The package casing receives a removal assistance (EH), intermediate layers and coating bags (31) with food product components (LK4) and a napkin (32) between an interior of the package casing and an outer side of baked good panes in each case with or without a heating device. The coating bags are not connected with the casing. An emptying of the coating bags takes place under utilization of a principle of emptying of a finger gap.</p> |
申请公布号 |
DE102010008965(A1) |
申请公布日期 |
2011.08.25 |
申请号 |
DE20101008965 |
申请日期 |
2010.02.19 |
申请人 |
ERDMANN, CLAUDIA;KLEPPEL, SUSANNE;SEIDEL, BERND;THATA, ERTUGRUL;WOISCHNIG, CHRISTOPH-ALEXANDER |
发明人 |
ERDMANN, CLAUDIA;KLEPPEL, SUSANNE;SEIDEL, BERND;THATA, ERTUGRUL;WOISCHNIG, CHRISTOPH-ALEXANDER |
分类号 |
B65D81/32;B65D25/04;B65D25/08;B65D81/34 |
主分类号 |
B65D81/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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