SUBSTRATE INTEGRATED WITH FIN, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a substrate integrated with fin and a method of manufacturing the same, capable of manufacturing the substrate integrated with fins equipped with heat radiation fins arranged at fine pitches in a simple process by a processing method suppressing warpage of a metal base plate and deformation (generation of a corrugated shape or the like) of the heat radiation fins.

SOLUTION: A metal circuit board 15 is bonded to a ceramic substrate 10 by a molten metal bonding method, and the plurality of heat radiation fins 20a are formed to a part to be cut which is a part of the metal base plate 20 by a grooving process of forming a plurality of grooves by performing anchoring with a tool to exert tensile stress on a surface of the cutting part to which the heat radiation fins 20a is to be formed, and moving a multi-cutter constituted by laminating a plurality of disk cutters onto the tensile-stress-exerted surface while rotating it.

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