发明名称 ADHESIVE FILM HOLDING MECHANISM
摘要 PROBLEM TO BE SOLVED: To hold an adhesive film without having an effect on intervals between chips supported by the adhesive film, even when the adhesive film is held by communicating negative pressure from an outer periphery of a holding surface to a suction groove formed on the holding surface. SOLUTION: An adhesive film holding mechanism has: a holding surface 34 that holds an adhesive film 105 to which a plurality of chips 104 supported by an opening of an annular frame via a tape 103 and that mutually has a predetermined interval are adhered, via the tape 103; a suction groove 341 formed on the holding surface 34; and a suction opening 332 connected to the suction groove 341 formed on the outer periphery side of the holding surface 34. The suction opening 332 is formed so as to locate eccentrically on one side of the outer periphery of the holding surface 34. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011165828(A) 申请公布日期 2011.08.25
申请号 JP20100025792 申请日期 2010.02.08
申请人 DISCO ABRASIVE SYST LTD 发明人 SATO JUN
分类号 H01L21/683;H01L21/301 主分类号 H01L21/683
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