| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition and an adhesive sheet having sufficient adhesive force between a base material and an adhesive layer and achieving high reliability of a semiconductor package. SOLUTION: The adhesive composition includes an acrylic binder (A), an epoxy-based thermosetting compound (B) and an energy ray-curable compound (C), wherein the acrylic binder (A) contains an acrylic polymer (A1) having a mass-average molecular weight of 300,000 to 1,200,000 and an acrylic polymer (A2) having a mass-average molecular weight of 10,000 to 120,000. COPYRIGHT: (C)2011,JPO&INPIT |
