| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate, capable of suppressing the occurrence of cracks near an interlayer connecting conductor section, preventing the destruction of a substrate, and enhancing the bonding strength of a protruding member, and to provide a method for producing the substrate. SOLUTION: The distance Z between the circumscribed circle of a brazing material layer 59, in the circumference of the bottom surface of a stud 23 and the area center of a via 55 disposed around a surface metal layer 57 on the top-surface low-temperature baking ceramic layer, is not less than 2.5 mm. Centered about the area center of the bottom surface of the stud 23, the difference (ML-RL) between the radial length ML of the surface metal layer 57 and the same radial length RL of the bottom surface of the brazing material layer 59 is not less than 0.65 mm, all around the circumference of the stud 23. Centered about the area center of the bottom surface of the stud 23, the ratio (VL/SL) between a radial length VL up to the area center of a via 55 closest to the stud 23 and the same radial length SL of the bottom surface of the stud 23 is from 1.6 to 2.0. COPYRIGHT: (C)2011,JPO&INPIT |
