| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of measuring characteristics of a characteristic check element easily by an OBIRCH method, and a manufacturing method for the semiconductor device. SOLUTION: The semiconductor device includes the characteristic check element whose characteristics are checked by exposing the element to laser light, and an upper wiring layer which is the characteristic check element and have dummy metals arranged on the wiring layer. The upper wiring layer has a first region overlapping the characteristic check element and a second region not overlapping the characteristic check element. The density of the dummy metals in the first region is smaller than the density of the dummy metals in the second region. COPYRIGHT: (C)2011,JPO&INPIT |
