| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-roughened copper foil excellent in etching workability, high heat-resistant adhesion property and high-frequency transmittance characteristic without migration failure, and to provide a circuit substrate which is obtained by laminating a heat-resistant copper foil excellent in the high-frequency transmittance characteristic onto a flexible resin substrate or a rigid resin substrate and is excellent in etching workability, high heat-resistant adhesion property and high-frequency transmittance characteristic without migration failure. SOLUTION: The surface roughened copper foil is provided with a primary roughened surface formed by subjecting at least one side surface of an untreated copper foil to an electrolytic roughening treatment by a pulse cathode using metal copper, a secondary treatment surface formed by subjecting the primary roughened surface to a flat plating treatment using metal copper, a tertiary treatment surface formed by subjecting the secondary roughened surface to a treatment using metal nickel and a quaternary treatment surface formed by subjecting the tertiary treatment surface to a treatment using metal zinc, in this order. A rust-preventive layer and a protective layer are disposed on the quaternary treatment surface as necessary. COPYRIGHT: (C)2011,JPO&INPIT |
