| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition that exhibits good workability to prevent handling crack, has high sensitivity, and produces a highly reliable cured product when used, e.g., in a printed wiring board or a semiconductor package, and to provide a dry film and cured product of the same, and a printed wiring board using the same. <P>SOLUTION: The photocurable resin composition developable with an alkali solution includes a carboxyl group-containing photosensitive resin, a photopolymerization initiator, a filler and an elastomer, where a content of the filler is 25-40 vol.% of a total amount of nonvolatile components in the composition, and a content ratio of the elastomer is as follows: filler:elastomer=90:10 to 70:30 (mass ratio). <P>COPYRIGHT: (C)2011,JPO&INPIT |
