| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition having superior insulation reliability, thermal shock resistance, storage stability, high sensitivity, adhesion to a substrate and heat resistance and suitable, especially, as a solder resist for a package; and to provide a photosensitive film, a photosensitive laminate, a method for forming a permanent pattern and a printed board using the photosensitive composition. <P>SOLUTION: The photosensitive composition includes at least a binder, a polymerizable compound, a photopolymerization initiator and an ion adsorbent, wherein the ion adsorbent includes at least one from among a bismuth compound, a zirconium compound and an antimony oxide compound. The bismuth compound is, preferably, bismuth oxide; the zirconium compound is preferably zirconium phosphate; and the antimony oxide compound is, preferably, antimony pentoxide. <P>COPYRIGHT: (C)2011,JPO&INPIT |
