| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device with more space saving capable of grinding/polishing a large-sized planar object. SOLUTION: In this grinding mechanism 4, a first polishing unit 43, a rough grinding unit 41, a finishing grinding unit 42 and a second polishing unit 44 are disposed in one direction in order. A holding mechanism 3 includes a first chuck table 311 arranged on the first polishing unit 43 side and a second chuck table 312 arranged on the second polishing unit 44 side. A control mechanism 6 positions the holding mechanism 3 at a first machining position where the first and second chuck tables 311 and 312 are opposed to the first polishing unit 43 and the rough grinding unit 41, at a second machining position where the first and second chuck tables 311 and 312 are opposed to the rough grinding unit 41 and the finishing grinding unit 42, and at a third machining position where the first and second chuck tables 311 and 312 are opposed to the grinding unit 42 and the second polishing unit 44 in order. COPYRIGHT: (C)2011,JPO&INPIT
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