发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface acoustic wave device that suppresses the corrosion of an electrode pad. SOLUTION: The surface acoustic wave device includes a piezoelectric substrate 2, a surface acoustic wave element 4 formed on the piezoelectric substrate 2, an electrode pad 14 that is formed on the piezoelectric substrate 2, made of at least one or more metal layers, and electrically connected with the surface acoustic wave element 4, a sealing part 6 for sealing the surface acoustic wave element 4, an electrode post 8 that is formed on the electrode pad 14 to penetrate the sealing part 6 and electrically connect with the electrode pad 14, and an insulation film 12 that is located on at least one metal layer among metal layers forming the electrode pad and is formed at least under a part of the interface between the sealing part 6 and the electrode post 8. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011166530(A) 申请公布日期 2011.08.25
申请号 JP20100028115 申请日期 2010.02.10
申请人 TAIYO YUDEN CO LTD 发明人 TSUDA KEIJI
分类号 H03H9/145;H01L23/12;H03H9/25 主分类号 H03H9/145
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